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NXP Semiconductors
Wire Bond Equipment EngineerNXP Semiconductors • Bangkok, Bangkok, Thailand
Wire Bond Equipment Engineer

Wire Bond Equipment Engineer

NXP Semiconductors • Bangkok, Bangkok, Thailand
1 วันที่แล้ว
คำบรรยายลักษณะงาน

Responsibilities:

  • Lead and manage wire bond equipment overhaul and rebuild activities to ensure maximum machine uptime and reliability.
  • Develop and implement preventive maintenance programs and calibration procedures for wire bond machine.
  • Drive continuous improvement initiatives focused on equipment performance process optimization and quality enhancement.
  • Analyze equipment downtime and root causes; implement corrective actions to minimize recurrence.
  • Collaborate with cross-functional teams to support production goals improve equipment utilization and meet customer quality requirements.
  • Develop innovative solutions and automation systems to enhance machine connectivity reduce manual intervention and improve operational efficiency.
  • Provide technical training and mentorship to engineers on wire bond equipment troubleshooting overhaul and process control.
  • Ensure compliance with environmental safety and quality standards in all equipment-related activities.
  • Lead projects that deliver measurable improvements in productivity cost reduction and quality performance.

Qualifications:

  • Education: Bachelors degree in Electronics Electrical Mechanical or related Engineering field.
  • Experience: Minimum 7 years of hands-on experience in wire bond equipment engineering or semiconductor assembly operations.
  • Proven expertise in wire bond machine platforms.
  • Strong background in machine overhaul rebuild calibration preventive and predictive maintenance.
  • Demonstrated ability to manage major repairs restoration and equipment qualification.
  • Solid understanding of quality systems SPC and root cause analysis for equipment-related issues.
  • Experience in continuous improvement methodologies (Lean Six Sigma) and driving cost-reduction projects.
  • Ability to develop and implement automation and innovative solutions for equipment and process improvement.
  • Excellent analytical troubleshooting and problem-solving skills.
  • Strong leadership and communication skills; ability to train and mentor technical teams.
  • Familiarity with data analytics and machine connectivity projects is a plus.


More information about NXP in Thailand...

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Required Experience:

IC


Employment Type : Full-Time
Experience: years
Vacancy: 1

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Wire Bond Equipment Engineer • Bangkok, Bangkok, Thailand