Senior Power Module Process Engineer

Job Title: Senior Power Module Process Engineer Job Summary Our client is seeking an experienced Senior Power Module Process Engineer to support the development and manufacturing of advanced semiconductor power-module products. The successful candidate will lead process characterization, establish critical manufacturing controls, and collaborate with cross-functional engineering teams to improve product quality, reliability, cost, and production performance. Key Responsibilities Conduct Design of Experiments (DOE) and process characterization for critical power-module manufacturing processes. Define process materials, operating parameters, tooling controls, and handling procedures. Develop and maintain process-design guidelines, control plans, and manufacturing specifications. Work closely with Process Engineering, Equipment Engineering, Quality, Product Management, and other technical teams. Troubleshoot complex manufacturing and product-quality issues. Analyse engineering and production data using statistical methods. Support process optimization, yield improvement, reliability improvement, and defect-reduction initiatives. Participate in cost-reduction projects related to power-module products. Prepare technical reports and communicate findings to internal stakeholders. Qualifications and Experience Bachelor's degree or higher in Electronics, Electrical Engineering, Mechanical Engineering, Materials Engineering, Chemical Engineering, Industrial Engineering, or a related field. At least five years of relevant experience in semiconductor assembly, power modules, wafer-level packaging, IC packaging, or electronic-module manufacturing. Practical experience in product or process development, material selection, assembly, or package reliability. Strong knowledge of engineering data analysis, SPC, DOE, APQP, and FMEA. Candidates must have detailed practical knowledge of at least two or three of the following processes: Advanced SMT, including high-density, multilayer, or double-sided component assembly. Silver or copper sintering, including pressure and pressureless sintering. Soft-solder die attach. Aluminium or aluminium-copper wedge and ribbon bonding. Vacuum or formic-acid reflow. Advanced flip-chip processes, including multi-die, stacked-die, fine-pitch flip chip, and thermo-compression bonding. Capillary underfill for fine-pitch flip-chip or thermo-compression bonding applications. Advanced copper-clip processes, including exposed copper clips. Heat-sink or heat-slug attachment. Advanced moulding, including double-sided moulding, low-wire-sweep moulding, liquid moulding, and compression moulding. Low-stress blade or laser-singulation processes. Key Copetencies Strong analytical and structured problem-solving skills. High level of responsibility and attention to detail. Quality-focused mindset with a strong commitment to zero-defect manufacturing. Effective cross-functional communication and coordination skills. Good command of English.