R&D Power Module Section Manager

Job Title: R&D Power Module Section Manager Job Summary Our client is seeking an experienced R&D Power Module Section Manager to provide technical leadership for the development and manufacturing of advanced semiconductor power-module products. This position will coordinate cross-functional engineering activities, establish product and process-design standards, and drive improvements in quality, reliability, cost, and manufacturing performance. Key Responsibilities Serve as the technical leader for power-module development and manufacturing activities. Coordinate with Process Engineering, Quality Assurance, Equipment Engineering, Product Management, Design Engineering, and other relevant teams. Establish product-design guidelines and design rules for power-module products. Define critical process parameters, control requirements, material-selection criteria, and package-reliability standards. Lead process-design, process-control, and manufacturing-readiness activities for new and existing products. Provide technical direction and resolve complex product, process, quality, and reliability issues. Review engineering data and ensure appropriate application of SPC, DOE, APQP, FMEA, and other quality methodologies. Communicate technical requirements, risks, and solutions to internal stakeholders and customers. Drive yield improvement, defect reduction, process optimization, and operational excellence. Lead or support cost-reduction projects related to power-module products. Coach and develop engineering team members while ensuring projects are delivered according to quality, cost, and timeline expectations. Qualifications and Experience Bachelor's degree or higher in Electronics, Electrical Engineering, Mechanical Engineering, Materials Engineering, Chemical Engineering, Industrial Engineering, or a related field. At least eight years of relevant experience in semiconductor assembly, power modules, wafer-level packaging, IC packaging, or electronic-module manufacturing. Previous experience in a technical leadership, project leadership, supervisory, or engineering-management capacity. Strong experience in product or process development, material selection, assembly, and package reliability. Strong knowledge of engineering data analysis, SPC, DOE, APQP, and FMEA. Candidates must have detailed practical knowledge of at least two or three of the following processes: Advanced SMT, including high-density, multilayer, or double-sided component assembly. Silver or copper sintering, including pressure and pressureless sintering. Soft-solder die attach. Aluminium or aluminium-copper wedge and ribbon bonding. Vacuum or formic-acid reflow. Advanced flip-chip processes, including multi-die, stacked-die, fine-pitch flip chip, and thermo-compression bonding. Capillary underfill for fine-pitch flip-chip or thermo-compression bonding applications. Advanced copper-clip processes, including exposed copper clips. Heat-sink or heat-slug attachment. Advanced moulding, including double-sided moulding, low-wire-sweep moulding, liquid moulding, and compression moulding. Low-stress blade or laser-singulation processes. Key Competencies Strong technical leadership and cross-functional coordination skills. Excellent analytical, decision-making, and problem-solving abilities. High level of responsibility and attention to detail. Quality-focused mindset with a strong commitment to zero-defect manufacturing. Ability to communicate effectively with technical teams, management, and customers. Good command of English.